Wieland Heyn
Micromechanical studies of interface properties in on-chip interconnect structures
Schriftenreihe Kompetenzen in Keramik und Materialdiagnostik / Publication series competencies in ceramics and materials diagnostics, Band 5
Hrsg.: Alexander Michaelis; Fraunhofer IKTS, Dresden
2024, 132  S., num., mostly col. illus. and tab, Softcover
Fraunhofer Verlag

mehr Infos

 

P. Pichler
Intrinsic Point Defects, Impurities, and Their Diffusion in Silicon
Computational Microelectronics
2004, XXI, 554 p.  S., 40 SW-Abb. 254 mm, Hardcover
Springer, Wien

mehr Infos

 

Keh-La Lin, Armin Kemna, Bedrich J. Hosticka
Modular Low-Power, High-Speed CMOS Analog-to-Digital Converter of Embedded Systems
The Springer International Series in Engineering and Computer Science Vol.722
2003, xxvi, 254   S., 10 SW-Abb.,. 240 mm, Hardcover
Springer, Berlin

mehr Infos

 

V. Palankovski, Rüdiger Quay
Analysis and Simulation of Heterostructure Devices
Computational Microelectronics
2004
2003, xx, 289   S., XX, 289 p. 235 mm, Hardcover
Springer, Wien

mehr Infos