Raphael Adamietz
A Method for the Assembly of Microelectronic Packages using Microwave Curing
Stuttgarter Beiträge zur Produktionsforschung, Band 80
Hrsg.: Fraunhofer IPA, Stuttgart
2018, 244  S., num., mostly col. illus. and tab., Softcover
Fraunhofer Verlag

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Svetan Ratchev
Precision Assembly Technologies and Systems
IFIP Advances in Information and Communication Technology .371
6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012, Proceedings
2012
2012, xii, 212   S., XII, 212 p. 235 mm, Hardcover
Springer

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