
Solare Energie- und Systemforschung / Solar Energy and Systems Research
Leonie Jakob
Hrsg.: Fraunhofer ISE
2025, 295 S., num., mostly col., illus. and tab., Softcover
Sprache: Englisch
Freiburg, Univ., Diss., 2024
Fraunhofer Verlag
ISBN 978-3-8396-2100-4
Inhalt
Through-mask electrochemical machining is a non-conventional metal patterning technique which allows very high etching rates using non-hazardous electrolytes. Consequently, it represents a promising alternative to chemical etching processes in a variety of applications, particularly in the context of printed circuit board (PCB) production. Nevertheless, the process is currently lacking a comprehensive understanding of the underlying reaction mechanisms.
This thesis examines the dissolution process at the microscopic and mechanistic levels by in-situ analysis and polarization studies conducted under a range of varying parameters, electrolytes, and metals. The first in-situ evidence for the so far only postulated surface film is found. A model for the dissolution mechanism at high current densities involving the surface film is postulated. Additionally, significant advances in process development are achieved.
Verfügbare Formate
Electrochemical Machining, Copper, Surface Films, Electrochemistry, Reaction Mechanisms,
* Alle Preise verstehen sich inkl. der gesetzlichen MwSt. Lieferung deutschlandweit und nach Österreich versandkostenfrei. Informationen über die Versandkosten ins Ausland finden Sie hier.